Photographs (about 100 KBytes each, click on the image for a larger view)

Top view of STEP without the TINI board installed.

Close up view of the SMT and through hole prototype area on all versions of STEP. It's hard to see due to the solder mask, but each SMT pad (.050 inch on center) is wired to a through hole for easy connection to other components or TINI pins. The SMT pads accomodate wide and narrow SOIC devices. This particular board has a blue LED wired in to a TINI pin and was used in the JavaOne demo.

STEP.IR without TINI module installed.

Close up of STEP.IR IrDA components.